Publications

BOOKS & PUBLICATIONS

PUBLISHED BOOKS

Pecht, Michael; McCluskey, Patrick; O’Shea, Terrance J.; Mahajan, Rahul, Packaging Materials And Their Properties, CRC Press, 1998.
O’Shea, Terrance; McGrath, Michael; Wireless Sensor Networks for Healthcare Applications, Artech Publishing, 2010.

PUBLICATIONS AND CONFERENCE PROCEEDINGS (SELECTED PAPERS)

“Advances in Sensor Technology to Improve Individual Contributions to Sustainability”, Intel Technology Journal, September 2012.
“Perceptive Edge”, Intel Embedded Research Summit, Chandler, AZ, February 28, 2012
“Sensors for Smarter Cities, Perceptive Edge”, SENSORCON invited keynote, San Jose, CA, March 2012
“Clinical gait assessment of older adults using open platform tools”, Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE, August 30 2011-September 3, 2011
“Technologies for Ambient Assisted Living,” Intel Corporation White Paper, November 2010.
“Quantifying the Performance of PIR Sensors and Associated Optics,” Intel Corporation White Paper, November 2010.
“SHIMMER™ – A Wireless Sensor Platform for Noninvasive Biomedical Research”, IEEE Sensors Journal, Vol 10 No. 9 September 2010.
“A common Personal Health Research Platform – SHIMMER™ and BIOMOBUIS™”, Intel Technology Journal, Vol 13. Issue 3 2009.
“Adapting Technology for Personal Healthcare”, Intel Technology Journal, Vol 13. Issue 3 2009.
A Study of Medication-Taking and Unobtrusive, Intelligent Reminding, Telemedicine and e-Health. October 2009, 15(8): 770-776.
Enabling affordable and efficiently deployed location based smart home systems, Technology and Health Care,Volume 17, Number 3 / 2009, pp. 221-235
Chapter 14: Fostering Social Engagement and Self-Efficacy in Later Life: Studies with Ubiquitous Computing, Awareness Systems: Advances in Theory, Methodology and Design, Springer-Verlog London, 2009
Determining sleep metrics and nocturnal activity using an unobtrusive pressure sensing grid, IET Digest / Vol2009, Issue 12725, IET Conference on Assisted Living 2009 (2009/12725), London, UK, 24-25 March 2009
A Bluetooth-based minimum infrastructure home localisation system. Wireless Communication Systems. 2008. ISWCS '08. IEEE International Symposium on (2008) pp. 638 - 642
The deployment of a non-intrusive alternative to sleep/wake wrist actigraphy in a home-based study of the elderly. Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE (2008) pp. 1687 - 1690
Single access point localisation for wearable wireless sensors. Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE (2008) pp. 4443 - 4446
Experimental evaluation of a single access point Bluetooth localisation system. Signals and Systems Conference, 208. (ISSC 2008). IET Irish (2008) pp. 254 - 259
Single access point location tracking for in-home health monitoring. Positioning, Navigation and Communication, 2008. WPNC 2008. 5th Workshop on (2008) pp. 23 - 29
Evaluation of Bluetooth Communications for the Deployment of Assisted Living Technologies in Home Environments, 29th IEEE EMBS Annual International Conference, August 2007.
Thermo-Mechanical Challenges In Stacked Packaging, Journal of Heat Transfer Engineering, July 2007
Non-Invasive Actigraphy-Based Sleep Monitoring, 4th Intel Ireland Research Conference and Raman Workshop, September 2007.
Indoor Location Tracking for Medication Adherence and Cognitive Health Monitoring, 4th Intel Ireland Research Conference and Raman Workshop, September 2007.
Figh: (Irish verb) – meaning to weave. Focusing Ireland on Global Health, 12th EMEA Academic Forum June 2007
Computational Modeling of the Reliability of Stacked Low Density Interconnects Devices, ITHERM2006, June 2006.
Reliability of Stack Packaging Varying the Die Stacking Architectures for Flash Memory Applications”, SEMITHERM 2006, August 2006.
Thermal Management of Stacked Die that Includes RAM, Flash and Logic Processors, Electronic Components and Technology Conference, 2006, Proceedings. 56th, vol., no. pp. 1963- 1968, 30 May-2 June 2006.
Geriatric Technological Aids 2006 EUGMS Geneva, August 2006
Management of Stacked Die that Includes RAM, Flash and Logic Processors”, ECTC, 2006
Why Elders Forget to Take Their Meds, Smart Homes and Beyond, IOS Press 2006
Why Elders Forget to Take Their Meds: A Probe Study to Inform a Smart Reminding System, ICOST 2006, June 2006
iNEMI 2004 Healthcare Roadmap, SMTA Medical Symposium 2005, Minn. MN.
Detecting and reflecting social health: Findings from in home trials of ubi-comp platforms with elders and caregivers, Elder-Care Symposium, Rochester NY May 2005.
Sensors for Tracking the Social Health of Elders, UCBioEng 2005, Santa Cruz, CA, June 2005.
Room to Room Location Tracking of Elders, Body Sensor Network Conference, Imperial College London, May 2005.
Human Interfaces in Societal Needs, GDEST Invited Speaker, Department of State, Tsukuba, Japan, March 2005.
Design for stackability of flash memory devices based on thermal optimization, Digital Avionics Systems Conference 24th , vol.2, no. pp. 14 pp. Vol. 2-, 30 Oct.-3 Nov. 2005
Thermal Comparison of Stacking Architectures for Flash Memory Applications, International Mechanical Engineering Congress and Exposition 2005, Orlando FL, November 5-11, 2005.
High Tech Senior Friendly Home, AASHA Conference, Nashville, TN, August 2004.
Short Range Radio-Frequency Issues for Sensors Installed in a Home Environment, SMTA PAN PAC 2005, Kauai, HI
Medical Needs for the Electronics Industry; Market Analysis and Electronic Roadmap Needs, IEEE Addressing the Healthcare Needs of Our Aging Population With Technology, Washington DC, 4 June 2004
Health Care Sector Roadmap 2004, NEMI 2004 Roadmap, under review, January 2004
Innovative Circuit Board Level Routing Designs for BGA Packages. , IEEE Transactions on CPMT Advanced Packaging, under review January 2004
A state of the art assessment of the Assembly Technology and Challenges for the Health Care Industry, SMTA-2004 Meeting, Invited Paper, March 2004.
Thermal Limitations of Stacked Die Packages, ITHERM 2004.
A method for improving component decoupling using advanced capacitor under ball grid array (ACUB), InterPACK 2003, July 6-11 Maui, HI.
Design and Assembly Methods for Improving High Current Board-Component Connectivity InterPACK 2003, July 6-11 Maui, HI.
Motherboard DFM Rules and Solutions for BGA Quality and Reliability, Intel Developers Forum, San Jose, CA, February 2003
Impact of Temperature Cycle Profile on Fatigue Life of Solder Joints, IEEE Transactions on CPMT Advanced Packaging, Vol. 25, No 3, pp. 433 –438, August 2002.
Manufacturability of Large SMT Connectors, AMSE International Mechanical Engineering Conference, New Orleans, Nov 2002
Experimental Characterization of Material Degradation of Solder Joint under Fatigue Loading, Proc. Of the VIIIth Intersociety Conference on Thermal and Thermo-mechanical Phenomena in Electronic Systems, May 29 - June1, 2002, San Diego, CA.
Reliability of Solder Bumps, Advanced Packaging, pp. 47-56, July 2002.
Thermo-mechanical Analysis of Solder Joints using Thermodynamics, InterPACK 2001, July 8-13 Kauai, Hawaii.
Computer Simulations of Solder Joint Reliability Tests,” Advanced Packaging, pp. 17-22, May 2001.
Selecting a Temperature Time History for Predicting Fatigue Life of Microelectronics Solder Joints, Journal of Thermal Stresses, Vol. 24, No. 11, pp. 1063-1084, November, 2001.
A strategy for enabling data-driven product decisions through a comprehensive understanding of the usage environment, Advances in Electronic Packaging, 2001, p 1279-1284
Evaluating Solder Joint Fatigue reliability by Moiré Interferometry, Proc. Of Advanced Packaging Technologies in the Electronics Industry, SMTA, June 12-13, 2001 Boston, MA
Thermo-mechanical Behavior of Micron Scale Solder Joints Under Dynamic Loads, Mechanics of Materials, Vol. 32, Issue 3, 161-173, 2000.
Inelastic Behavior of Microelectronics Solder Joints Under Concurrent Vibration and Thermal Cycling, proc. Itherm 2000, VIIth Thermal and Thermo-mechanical Phenomena in Electronic Systems, Vol. II, pp. 349-355, Las Vegas, NV May 23-26, 2000.
Thermo-mechanical Behavior of BGA Solder Joints Under Vibrations; An Experimental Observation, Proc. Itherm 2000, VIIth Thermal and Thermo-mechanical Phenomena in Electronic Systems, Vol. I, pp.174-180, Las Vegas, NV May 23-26, 2000.
Effects of Thermodynamic Loading, Advanced Packaging, pp. 51-58, October 2000
Methodology to determine the usage of computer systems during operation, (IEEE-ECTC’00 Las Vegas, NV)
Thermo mechanical Behavior of Micron Scale Solder Joints: An Experimental Observation, Journal of the Mechanical Behavior of Materials, Vol. 10, No. 3, 135-146, 1999.
Creep Behavior of BGA During Thermal Cycling by Moiré Interferometry, Advances in Electronic Packaging, Editors Agonafer, G, Saka, M. and Lee, Y.C. ASME-EEP-Vol. 26-1, pp 685-691.
Mechanical Behavior of BGA During Vibrations by Moiré Interferometry and FEM Simulation, ASME, Int. Mechanical Engineering Congress and Exposition, Nashville, TN November, 14-19, 1999.
Flow Network Modeling for Improving Flow Distribution of Micro-Electronic Burn-In Oven, (accepted IEEE/AMSE ITHERM’ 00)
System-Level Design for Electronic Packaging and Production, Advanced Packaging Magazine, June/July 1999.
A Method for Thermally Controlled Die Backside Emission Imaging, 1999 Quality and Reliability Conference, Intel Corporation, Chandler, Arizona, October 1999.
Evaluation of Dynamic Stress in S9K Sockets, 1999 Quality and Reliability Conference, Intel Corporation, Chandler, Arizona, October 1999.
Extending the C18HD Capability to Willamette, 1999 Quality and Reliability Conference, Intel Corporation, Chandler, Arizona, October 1999.
Proactive Modeling Utilizing Damage Mechanics Coupled With Time Scaling, 1999 Quality and Reliability Conference, Intel Corporation, Chandler, Arizona, October 1999.
Electronic Packaging Materials, CRC Press, approximately 190 pages, 1998.
Thermo mechanical Analysis in Electronic Packaging with Unified Constitutive Model for Materials and Joints, IEEE Transactions on CPMT Part B Adv. Packaging, February 1998, Vol 21, No. 1.
Perspectives in Understanding Risks in the Electronics Industry, IEEE Transactions on CPMT Part A, December 1997, Vol 20, No. 12.
Hollow Fibers in Woven Laminates, Printed Circuit Fabrication, January 1997, Vol 20, No. 1.
Evaluation of Dynamic Stress in S9K Sockets, Intel Assembly Test Technology Journal, 1999.
Utilizing Experimental Stress Analysis to Aid in Rapid Prototyping in Packaging Assembly, Intel Assembly Test Technology Journal, 1999.
Creep Behavior of BGA During Thermal Cycling By Moiré Interferometry And FEM Simulation, T.Fourth Int. Conf. on Constitutive Laws for Engineering Materials at RPI Troy, NY
BGA Plastic Strain Monitoring During Thermal Cycling By Specimen Stepping Method and Moiré Interferometry, ASME Interpack ’99
Disturbed State Constitutive Model for Thermomechanical Behavior of Dislocated Silicon with Impurities, Journal of Applied Physics, Published December 98.
In-Situ Measurements of Plastic Encapsulated MicroCircuits During Reflow, Circuit World, December 98.
Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown, Journal of Electronic Packaging Transactions of AMSE, Vol 121, June 1999.
Calibration of the Disturbed State Model for Thermo-mechanical Behavior of Various Solders, AMSE Interpack ’99, June 1999.
Disturbed State Modeling of a Ceramic Ball Grid Array, McNU 97 ASME/SES/BSE Applications on FEM and BEM to Electronic Packaging, Northwestern University, June 97.
Criteria For The Assessment Of A Manufacturer Parts Family, CALCE Spring Review University of Maryland
Conductive Filament Formation in Fine-line/Low Voltage PWB’s CALCE Spring Review University of Maryland
A Feasibility Study on Health Monitoring and Early Detection Fuse Structures, CALCE Spring Review University of Maryland.
Uprating of Commercial Parts for Use in Harsh Environments, CALCE Spring Review University of Maryland.
Manufacturability of Lead-Free Solders, Second Workshop on Temperature Power Electronics for Vehicles, April 1997, Adelphi MD.
Evaluation of factors affecting bonding rate of calcium phosphate ceramic coatings for in vivo strain gage attachment. Journal of Biomedical Materials Research 33:121-132, 1996.